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Advanced Microsystems for Automotive Applications 2003 by Florian Solzbacher (auth.), Dr. Jürgen Valldorf, Dr.

By Florian Solzbacher (auth.), Dr. Jürgen Valldorf, Dr. Wolfgang Gessner (eds.)

Microsystems are a tremendous issue that give a contribution to an car model's good fortune. to fulfill the customers's wish for protection, comfort and car economic climate, and to fulfill environmental criteria, microsystems are the severe issue. Microsystems purposes (MST) have already led to more advantageous functionality and higher worth for funds. however the advances carried out show in simple terms the start of a revolution within the automobile zone, which goals at a whole transition from the robotically pushed motor vehicle method to a routinely established yet ICT-driven procedure. the chosen contributions from AMAA 2003 deal with security (both preventive and protective), powertrain (online dimension and regulate of engine and transmission subsystems), convenience and HMI (systems to reinforce the relief of passengers and human computer interface issues), and networked automobile (all features of intra vehicle structures and ambient conversation networks). chosen complaints for the 7th convention on microsystems within the automobile zone, a standard occasion now with more and more contributors on a contemporary and promising box occurring in Berlin in might 2003.

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Are easily possible. A first prototype of the intelligent reflector was assembled and is depicted in figure 10. The necessary electronic is objective for further miniaturization and depicted on the right hand side of the picture. Micro-Mechatronics in Automotive Applications Fig. 10. First prototype of the intelligent reflector. 3 Integration of Micro-Mechatronic in Mechanical Engineering Areas »Smart Shaft« is a synonym for the integration of micro-mechatronic in mechanical engineering parts. This process demands the assembly of sensor systems and electronics directly into the mechanical engineering part.

These system approaches show, compared to the existing solutions, a higher functionality, more intelligence and better reliability performance. The paper presents system solutions and manufacturing technology for mechatronic systems, developed at Fraunhofer IZM MicroMechatronic Center. Special emphasis is given to novel rapid prototyping processes enabling a faster system development as well as a more consequent integration of electronics in mechanics. The mechatronic packages will be discussed in detail.

With less sensitive devices like field detectors or thick film sensors, such rigorous protection is not necessary. After fabrication, the wafers are diced using standard dicing equipment. Then, they are singulated and packaged in individual housings like: Metal. Ceramic. Plastic. packages. Plastic packaging as used in the microelectronic industry has several draw backs like: Stress induced due to the electronic molding compound (EMC) process influencing sensor characteristics. g. pressure of sampling gas).

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